・This wafer edge grinder machine is designed to form an edge bevel on 2 inch to 8 inch diameter wafers. ・The range of materials that can be processed includes silicon and many other semiconductive substrates. ・This model replaces the well-established DE(N)P series. Wafer also makes a ground-breaking chamfering system that can form a trapezoid or radius shape on the edge of an AS-slice wafer using the same resin-bonded wheel.
Daitron is your source for premium wafer bevels. As a trusted electronic component and capital equipment global distributor, we are dedicated to providing the best customer service with competitive pricing. We work with a broad spectrum of industries, supplying wafer edge grinder for various applications, including semiconductors, solar cells, electronics, heavy-duty industrial, transportation, medical and biomedical, fiberoptic, and more. With decades of experience, the team at Daitron is committed to providing high-quality wafer bevels that meet customers' demands. Trust Daitron to supply your industry-leading products.
*cassettes: number of cassettes is dictated by wafer size.
*non symetric & *step or terrace type: grinding wheel shape will reflect the bevel shape.
note : specifications above may change without notice Visit our WBM-2000 Series manufacturing page