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WBM Wafer Bevel Machine

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・This wafer edge grinder machine is designed to form an edge bevel on 2 inch to 8 inch diameter wafers.
・The range of materials that can be processed includes silicon and many other semiconductive substrates.
・This model replaces the well-established DE(N)P series.

Wafer also makes a ground-breaking chamfering system that can form a trapezoid or radius shape on the edge of an AS-slice wafer using the same resin-bonded wheel. 

Trusted Supplier for High-Performance Wafer Beveling Machine 

Daitron is your source for premium wafer bevels. As a trusted electronic component and capital equipment global distributor, we are dedicated to providing the best customer service with competitive pricing. We work with a broad spectrum of industries, supplying wafer edge grinder for various applications, including semiconductors, solar cells, electronics, heavy-duty industrial, transportation, medical and biomedical, fiberoptic, and more. With decades of experience, the team at Daitron is committed to providing high-quality wafer bevels that meet customers' demands. Trust Daitron to supply your industry-leading products.

Wafer Bevel Machine Features:

  • Compact Design - 50% less foot print area compared to existing model DENP-250A and competitors
  • High Accuracy - By utilizing one-piece cast iron frame, the vibration during grinding was better controlled and damage on wafer edge, which minimizes chipping.
  • High Machine Stiffness - To obtain higher stiffness of the spindle unit, Z axis movement from spindle was eliminated.
  • OF Linearity Improved by 33% - OF linearity specification has been improved from 15um to 10um. By consolidating X-Y- θ -Z unit into one unit, instead of having two separate moving units, OF linearity specification has been improved. 
  • Easy Maintenance - Improved accessibility to all internal mechanisms and controls makes the WBM-2000 easier to maintain. Grinding wheel change can be accomplished with convenient access from the side. The result is higher productivity with less downtime.
  • Easy Operation - Operator control using LCD touch panel and easy to understand menu screens.
  • High Efficiency - Max 163 wfrs / hr with max speed of 22 sec / wfr. (15 sec / wfr using dual axis model) with wafer exchange time of 10 sec / wfr (WBM-2200)
    • Motor used for Grinding Y axis and Grinding Z axis were converted from stepping motor to AC servomotor for higher precision.
    • Mechanical layout of the machine was also renewed.
    • Wafer Transfer unit is relocated to center of both grinding stations to minimize the transfer distance.
 

Wafer Beveling Machine Basic Specifications

model WBM-2100 WBM-2200
GD unit qty of grind axis 1 2
wafer size 2" ～ 6" selectable
3" ～ 8" selectable
wafer type OF OK
notch option
material silicon OK
compound wafer option
single element wafer option
SOI option
others option
load / unload cassettes* 4 to 8
non-cassette option
spindle for 200mm wheel std.
for 100mm wheel option
for notch wheel option
thickness gauge contact 1 pt. option
contact multi pts. option
non-contact multi. pts. option
alignment unit edge non-contact selectable
edge grip selectable
cleaner unit spin cleaner std.
diameter meas. pre-grind option
post grind option
bevel shape R type std.
T type std.
Flat type std.
non symetric* std.
step or terrace type* option

*cassettes: number of cassettes is dictated by wafer size.

*non symetric & *step or terrace type: grinding wheel shape will reflect the bevel shape.

note : specifications above may change without notice

Visit our WBM-2000 Series manufacturing page