CVP Wafer Contouring Vertical Polisher

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Wafer Edge Contouring Machine

This ground-breaking chamfering system can form a trapezoid or radius shape on the edge of an AS-slice wafer using the same resin-bonded wheel. Edge processing of the device wafer prior to BG decreases the amount of wafer breakage or chipping after BG.

Contouring Vertical Polisher Machine Features

  • Two grinding stations
  • Enhanced processing accuracy and shortened processing time by using the Twin-contouring" method, compared to the conventional machine.
  • Reduced processing time compared to the conventional machine.
  • A built-in wafer profile measurement device is available.
  • Enables measurement of the cross-section profile after processing for feedback correction of the processing data.

Basic CVP Specifications

  • Wafer type: Notch
  • Wafer Size: 12 in or 8 in (selectable)
  • Loading/Unloading: 8-cassette or 2 dry stacks to 6-cassette or 4-cassette (or 2-casstte) (selectable)
  • Thickness Measurement Unit: Multi-point measurement
  • Fine alignment: Edge contact or non-edge contact
  • Qty of grid axis: Two stations
  • Spindle: [1] Horizontal circumference grinding (coarse) Metal-bonded wheel (100mm) (Optional), [2] Vertical circumference contouring (finish) Resin bonded wheel (60mm), [3] Vertical circumference contouring 2 (finish) Resin-bonded wheel (60mm) (Optional), [4] Notch grinding (horizontal)
  • Metal-bonded wheel (Optional)
  • Washing Unit: Included (Edge polishing, 2-fluid washing, high-pressure jet can be included.) (Optional)
  • Profile Measurement: Measurement items: cross-section profile, notch profile, diameter, notch vertical surface width
 
  CVP-80 CVP-211B CVP-310B CVP-320
Wafer type OF(CF) or Notch OF(CF) or Notch OF or Notch Notch
Wafer size 2-inch to 8-inch 2-inch to 6-inch 12-inch or 8-inch, 6-inch 12-inch or 8-inch (selectable)
Loading/Unloading None 4-cassette 4-cassette (or 2-cassette) or 1 dry stack-to-1 dry stack (selectable) 8-cassette or 2 dry stacks to 6-cassette or 4-cassette (or 2-casstte) (selectable)
Thickness measurement unit None Multi-point or a center point measurement (Optional) Multi-point or a center point measurement (Optional) Multi-point measurement
Fine alignment Contact type Edge contact or Non-edge contact Edge contact or Non-edge contact (selectable) Edge contact or Non-edge contact
Qty of grind axis One station One station One station Two stations
Spindle [1] Horizontal circumference grinding (coarse)
Metal-bonded wheel (100mm) (Optional)
[1] Horizontal circumference grinding (coarse)
Metal-bonded wheel (100mm) (Optional)
[1] Horizontal circumference grinding (coarse)
Metal-bonded wheel (100mm) (Optional)
[1] Horizontal circumference grinding (coarse)
Metal-bonded wheel (100mm) (Optional)
[2] Vertical circumference contouring (finish)
Resin-bonded wheel (50mm)
[2] Vertical circumference contouring (finish)
Resin-bonded wheel (60mm)
[2] Vertical circumference contouring (finish)
Resin bonded wheel (60mm)
[2] Vertical circumference contouring (finish)
Resin bonded wheel (60mm)
  [3] Vertical circumference contouring 2 (finish)
Resin-bonded wheel (60mm) (Optional)
[3] Vertical circumference contouring 2 (finish)
Resin-bonded wheel (60mm) (Optional)
[3] Vertical circumference contouring 2 (finish)
Resin-bonded wheel (60mm) (Optional)
  [4] Notch grinding (horizontal)
Metal-bonded wheel (Optional)
[4] Notch grinding (horizontal)
Metal-bonded wheel (optional)
[4] Notch grinding (horizontal)
Metal-bonded wheel (Optional)
Washing unit None Included (Edge polishing, 2-fluid washing, high-pressure jet can be included.) (Optional) Included (Edge polishing, 2-fluid washing, high-pressure jet can be included.) (Optional) Included (Edge polishing, 2-fluid washing, high-pressure jet can be included.) (Optional)
Diameter measurement None Included Included Measurement items: cross-section profile, notch profile, diameter, notch vertical surface width

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